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bd6563fv-lb product structure silicon monolithic integrated circuit this product is not designed prot ection against radioactive rays 1/16 tsz02201-0717abz00030-1-2 ? 2012 rohm co., ltd. all rights reserved. 13.jul.2012 rev.002 www.rohm.com tsz22111 ? 14 ? 001 datashee t bd6563fv-lb small signal igbt/mosfet gate driver series three-channel small signal igbt/mosfet gate drivers bd6563fv-lb general description bd6563fv-lb is 3-ch gate driver to drive gate of igbt/mosfet from 5v input signals. output signals consist of each high side and low side drive signals in order to make on/off timing control easy. 1 input signal generates 2 output signals which are high side output and low side output signal for 1 channel drive. high side output signal outputs "h" level and high impedance and low side output signal outputs "l" signal and high impedance. features ? three-channel gate drivers ? separated turn on and turn off output applications ? low-side igbt/mosfet gate drive for dcdc converter ? low-side igbt/mosfet gate drive for inverter key specifications ? output-side supply voltage(max.): 30v ? input-side supply voltage: 3.0v to 5.5v ? output peak current( Q 1us): 0.6a ? input-output delay time (at vdd=3.3v):380ns(max.) ? input-output delay time (at vdd=5.0v):345ns(max.) ? operating temperature range: -25 to +125 package w(typ.) x d(typ.) x h(max.) ssop-b16 5.00mm x 6.40mm x 1.35mm typical application circuit figure 1. typical application circuit ssop-b16 in1, in2, in3 out_h1, out_h2, out_h3 out_l1, out_l2, out l3
datasheet d a t a s h e e t 2/16 bd6563fv-lb tsz02201-0717abz00030-1-2 ? 2012 rohm co., ltd. all rights reserved. 13.jul.2012 rev.002 www.rohm.com tsz22111 ? 15 ? 001 out_h1 out_l1 out_h2 v cc vdd lgnd in1 pgnd out_l2 pgnd out_l3 in2 in 3 lgnd vcc out_h3 pin configuration pin description pin no. pin name function 1 vcc output-side power supply pin 2 vdd input-side power supply pin 3 lgnd input-side ground pin 4 in1 control input 1 pin 5 in2 control input 2 pin 6 in3 control input 3 pin 7 lgnd input-side ground pin 8 vcc output-side power supply pin 9 out_l3 low-side output 3 pin 10 out_h3 high-side output 3 pin 11 pgnd output-side ground pin 12 out_l2 low-side output 2 pin 13 out_h2 high-side output 2 pin 14 pgnd output-side ground pin 15 out_l1 low-side output 1 pin 16 out_h1 high-side output 1 pin figure 2. pin configuration (top view) 15 16 14 13 3 4 2 1 11 12 10 9 7 8 6 5
datasheet d a t a s h e e t 3/16 bd6563fv-lb tsz02201-0717abz00030-1-2 ? 2012 rohm co., ltd. all rights reserved. 13.jul.2012 rev.002 www.rohm.com tsz22111 ? 15 ? 001 block diagram figure 3. block diagram in1 v cc out_h1 lgnd v dd pgnd level shift out_l1 in2 out_h2 level shift filter out_l2 in3 out_h3 level shift filter out_l3 filter
datasheet d a t a s h e e t 4/16 bd6563fv-lb tsz02201-0717abz00030-1-2 ? 2012 rohm co., ltd. all rights reserved. 13.jul.2012 rev.002 www.rohm.com tsz22111 ? 15 ? 001 absolute maximum ratings parameter symbol limits units output-side supply voltage v ccmax 30 v input-side supply voltage v ddmax 7 v inx *1 pin input voltage v inxmax -0.3 to vdd+0.3 v out_hx / out_lx *1 pin output voltage v outhxmax v outlxmax -0.3 to vcc+0.3 v out_hx *1 pin output current (peak 1us) i outhxmax -0.6* 2 a out_lx *1 pin output current (peak 1us) i outlxmax +0.6* 2 a power dissipation p d 0.87* 3 w operating temperature range t opr -25 to +125 storage temperature range t stg -55 to +150 junction temperature t jmax +150 *1 x=1,2,3 *2 should not exceed pd and tj=150 ? c. *3 derate above ta=25 ? c at a rate of 7.0mw/ ? c. mounted on a glass epoxy of 70 mm ? 70 mm ? 1.6 mm. recommended operating ratings parameter symbol min. max. units output-side supply voltage v cc 10 25 v input-side supply voltage v dd 3.0 5.5 v inx *1 high level input voltage v dd v dd 0.7 - v inx *1 low level input voltage v dd - v dd 0.3 v *1 x=1,2,3
datasheet d a t a s h e e t 5/16 bd6563fv-lb tsz02201-0717abz00030-1-2 ? 2012 rohm co., ltd. all rights reserved. 13.jul.2012 rev.002 www.rohm.com tsz22111 ? 15 ? 001 electrical characteristics unless otherwise specified t a =-25 to 125 , v dd =3.0v to 5.5v, v cc =10v to 25v parameter symbol min. typ. max. unit conditions inx * 1 pull-down resistance r inx 25 50 100 k ? output-side circuit current 1 i cc1 - 0.32 1 ma in1=in2=in3=0v output-side circuit current 2 i cc2 - 0.43 1 ma in1=in2=in3=25khz, duty=50% input-side circuit current 1 i dd1 - 0 10 ua in1=in2=in3=0v input-side circuit current 2 i dd2 - 25 100 ua in1=in2=in3=25khz, duty=50% high level output voltage v outhx vcc-2.0 vcc-1.0 vcc-0.4 v i outhx =-100ma low level output voltage v outlx 0.15 0.4 1.0 v i outlx =100ma output delay time h 1 t plhx1 170 250 330 ns v dd =5.0v output delay time l 1 t phlx1 185 265 345 ns v dd =5.0v delay matching 1, out_hx and out_lx t plhx1 ? t phlx1 * 1 S t plhx1-phlx1 -30 -15 0 ns v dd =5.0v output delay time h 2 t plhx2 170 250 330 ns v dd =3.3v output delay time l 2 t phlx2 220 300 380 ns v dd =3.3v delay matching 2, out_hx and out_lx t plhx2 ? t phlx2 * 1 S t plhx2-phlx2 -80 -50 0 ns v dd =3.3v delay matching, out_h1,out_h2,out_h3 t plhx ? t plhy * 1 S t plh -20 0 20 ns delay matching, out_l1,out_l2,out_l3 t phlx ? t phly * 1 S t phl -20 0 20 ns *1 x=1,2,3, y=1,2,3
datasheet d a t a s h e e t 6/16 bd6563fv-lb tsz02201-0717abz00030-1-2 ? 2012 rohm co., ltd. all rights reserved. 13.jul.2012 rev.002 www.rohm.com tsz22111 ? 15 ? 001 typical performance curves 25.0 40.0 55.0 70.0 85.0 100.0 3.03.54.04.55.05.5 v dd [v] r inx [k ] 25.0 40.0 55.0 70.0 85.0 100.0 -40-20 0 20406080100120 ta [ ] r inx [k ? ] figure 4. inx pull-down resistance ta=125 ta = 2 5 ta = - 2 5 v dd =5.5v v dd =3.0v v dd =5.0v figure 5. inx pull-down resistance 0.0 0.2 0.4 0.6 0.8 1.0 10 15 20 25 v cc [v] i cc1 [ma] 0.0 0.2 0.4 0.6 0.8 1.0 -25 0 25 50 75 100 125 ta [ ] i cc1 [ma] figure 6. output-side circuit current at in1=in2=in3=l ta=125 ta = 2 5 ta = - 2 5 vcc=25v vcc=15v vcc=10v figure 7. output-side circuit current at in1=in2=in3=l
datasheet d a t a s h e e t 7/16 bd6563fv-lb tsz02201-0717abz00030-1-2 ? 2012 rohm co., ltd. all rights reserved. 13.jul.2012 rev.002 www.rohm.com tsz22111 ? 15 ? 001 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 10 15 20 25 v cc [v] i cc2 [ma] 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 -25 0 25 50 75 100 125 ta [ ] i cc2 [ma] figure 8. output-side circuit current at in1=in2=in3=25khz and duty=50% figure 9. output-side circuit current at in1=in2=in3=25khz and duty=50% ta=125 ta = 2 5 ta = - 2 5 vcc=25v vcc=15v vcc=10v -1.0 1.0 3.0 5.0 7.0 9.0 3.0 3.5 4.0 4.5 5.0 5.5 v dd [v] i dd1 [ua] -1.0 1.0 3.0 5.0 7.0 9.0 -25 0 25 50 75 100 125 ta [ ] i dd1 [ua] figure 10. input-side circuit current at in1=in2=in3=l ta=125 ta = 2 5 ta = - 2 5 figure 11. input-side circuit current at in1=in2=in3=l v dd =3.0v v dd =5.0v v dd =5.5v
datasheet d a t a s h e e t 8/16 bd6563fv-lb tsz02201-0717abz00030-1-2 ? 2012 rohm co., ltd. all rights reserved. 13.jul.2012 rev.002 www.rohm.com tsz22111 ? 15 ? 001 0.0 10.0 20.0 30.0 40.0 50.0 60.0 70.0 80.0 90.0 100.0 -25 0 25 50 75 100 125 ta [ ] i dd2 [ua] figure 12. input-side circuit current at in1=in2=in3=25khz and duty=50% figure 13. input-side circuit current at in1=in2=in3=25khz and duty=50% ta=125 ta = 2 5 ta = - 4 0 v dd =5.5v v dd =5.0v v dd =3.0v 0.0 20.0 40.0 60.0 80.0 100.0 3.03.54.04.55.05.5 v dd [v] i dd2 [ua] ta=125 ta = 2 5 ta = - 2 5 -2.00 -1.60 -1.20 -0.80 -0.40 10 15 20 25 v cc [v] v outhx [v] -2.00 -1.60 -1.20 -0.80 -0.40 -25 0 25 50 75 100 125 ta [ ] v outhx [v] figure 14. high level output voltage ta=125 ta = 2 5 ta = - 2 5 vcc=25v vcc=15v vcc=10v figure 15. high level output voltage vcc vcc
datasheet d a t a s h e e t 9/16 bd6563fv-lb tsz02201-0717abz00030-1-2 ? 2012 rohm co., ltd. all rights reserved. 13.jul.2012 rev.002 www.rohm.com tsz22111 ? 15 ? 001 170 190 210 230 250 270 290 310 330 3.0 3.5 4.0 4.5 5.0 5.5 v dd [v] t plhx [ns] 0.15 0.30 0.45 0.60 0.75 0.90 10 15 20 25 v cc [v] v outlx [v] 0.15 0.30 0.45 0.60 0.75 0.90 -25 0 25 50 75 100 125 ta [ ] v outlx [v] ta=125 ta = 2 5 ta = - 2 5 figure 16. low level output voltage figure 17. low level output voltage 170 190 210 230 250 270 290 310 330 -25 0 25 50 75 100 125 ta [ ] t plhx [ns] figure 18. output delay time h ta=125 ta = 2 5 ta = - 2 5 v dd =5.5v v dd =5.0v v dd =3.0v figure 19. output delay time h vcc=10v vcc=15v vcc=25v
datasheet d a t a s h e e t 10/16 bd6563fv-lb tsz02201-0717abz00030-1-2 ? 2012 rohm co., ltd. all rights reserved. 13.jul.2012 rev.002 www.rohm.com tsz22111 ? 15 ? 001 -80 -70 -60 -50 -40 -30 -20 -10 0 -25 0 25 50 75 100 125 ta [ ] S t plhx - t phl x [ns] 185 200 215 230 245 260 275 290 305 320 335 350 365 380 -25 0 25 50 75 100 125 ta [ ] t phlx [ns] ta=125 ta = 2 5 ta = - 4 0 v dd =5.5v v dd =5.0v v dd =3.0v figure 20. output delay time l figure 21. output delay time l 185 200 215 230 245 260 275 290 305 320 335 350 365 380 3.0 3.5 4.0 4.5 5.0 5.5 v dd [v] t phlx [ns] ta = - 2 5 ta = 2 5 ta=125 -80 -70 -60 -50 -40 -30 -20 -10 0 3.0 3.5 4.0 4.5 5.0 5.5 v dd [v] S t plhx - t phlx [ns] figure 22. delay matching, out_hx and out_lx ta=125 ta = 2 5 ta = - 2 5 v dd =5.0v v dd =5.5v v dd =3.0v figure 23. delay matching, out_hx and out_lx
datasheet d a t a s h e e t 11/16 bd6563fv-lb tsz02201-0717abz00030-1-2 ? 2012 rohm co., ltd. all rights reserved. 13.jul.2012 rev.002 www.rohm.com tsz22111 ? 15 ? 001 -20 -15 -10 -5 0 5 10 15 20 -25 0 25 50 75 100 125 ta [ ] S t plh [ns] -20 -15 -10 -5 0 5 10 15 20 3.0 3.5 4.0 4.5 5.0 5.5 v dd [v] S t plh [ns] figure 24. delay matching, out_h1, out_h2, out_h3 ta=125 ta = 2 5 ta = - 2 5 v dd =5.0v v dd =5.5v v dd =3.0v figure 25. delay matching, out_h1, out_h2, out_h3 figure 26. delay matching, out_l1, out_l2, out_l3 figure 27. delay matching, out_l1, out_l2, out_l3 -20 -15 -10 -5 0 5 10 15 20 3.0 3.5 4.0 4.5 5.0 5.5 v dd [v] S t phl [ns] -20 -15 -10 -5 0 5 10 15 20 -25 0 25 50 75 100 125 ta [ ] S t phl [ns] v dd =5.0v v dd =5.5v v dd =3.0v ta=125 ta = 2 5 ta = - 2 5
datasheet d a t a s h e e t 12/16 bd6563fv-lb tsz02201-0717abz00030-1-2 ? 2012 rohm co., ltd. all rights reserved. 13.jul.2012 rev.002 www.rohm.com tsz22111 ? 15 ? 001 timing chart *1 under condition that out_ hx and out_lx are shorted. power dissipation please confirm that the ic?s chip temperature tj is not over 150 , while considering the ic?s power consumption (w), package power (pd) and ambient temperature (ta). when tj=150 is exceeded the functions as a semiconductor do not operate and some problems (ex. abnormal o peration of various parasitic elements an d increasing of leak current) occur. constant use under these circumstances leads to det erioration and eventually ic may destruct. tjmax=150 must be strictly obeyed under all circumstances. inx out_hx out_lx (high-z)* 1 lgnd vdd vdd/2 vcc/2 t plhx t phlx vdd/2 vcc/2 vcc (high-z)* 1 pgnd figure 28. timing chart 0 0.25 0.5 0.75 1 0 255075100125150 ambient temperature: ta( ) power dissipation : pd w) 0.87w figure 29. ssop-b16 derating curve
datasheet d a t a s h e e t 13/16 bd6563fv-lb tsz02201-0717abz00030-1-2 ? 2012 rohm co., ltd. all rights reserved. 13.jul.2012 rev.002 www.rohm.com tsz22111 ? 15 ? 001 i/o equivalence circuits pin no. name i/o equivalence circuits function 4, 5, 6 in1, in2, in3 control input x pin 9, 12, 15 out_l1, out_l2, out_l3 low-side output x pin 10, 13, 16 out_h1, out_h2, out_h3 high-side output x pin out_h1, out_h2, out_h3 pgnd vcc out_l1, out_l2, out_l3 pgnd vcc in1, in2, in3 lgnd vdd
datasheet d a t a s h e e t 14/16 bd6563fv-lb tsz02201-0717abz00030-1-2 ? 2012 rohm co., ltd. all rights reserved. 13.jul.2012 rev.002 www.rohm.com tsz22111 ? 15 ? 001 operational notes (1) absolute maximum ratings an excess in the absolute maximum ratings, such as supply voltage, temperature range of operating conditions, etc., can break down the devices, thus maki ng impossible to identify breaking mode, such as a short circuit or an open circuit. if any over rated values will expect to exceed the absolute maximum ratings, consider adding circuit protection devices, such as fuses. (2) connecting the power supply connector backward connecting of the power supply in reverse polarity c an damage ic. take precautions when connecting the power supply lines. an external direction diode can be added. (3) power supply lines design pcb layout pattern to provide low impedance gnd and supply lines. to obtain a low noise ground and supply line, separate the ground section and s upply lines of the digital and analog blocks. furthermore, for all power supply terminals to ics, connect a capacitor between the power supply and the gnd terminal. when applying electrolytic capacitors in the circuit, not that capacitance char acteristic values are reduced at low temperatures. (4) gnd potential the potential of lgnd pin and pgnd pin must be minimum potential in all operating conditions. (5) thermal design use a thermal design that allows for a sufficient margin in li ght of the power dissipation (pd) in actual operating conditions. (6) inter-pin shorts and mounting errors when attaching to a printed circuit boar d, pay close attention to the directi on of the ic and displacement. improper attachment may lead to destruction of the ic. there is also possibility of destruction from short circuits which can be caused by foreign matter entering between output s or an output and the power supply or gnd. (7) operation in a strong electric field use caution when using the ic in the pr esence of a strong electromagnetic field as doing so may cause the ic to malfunction. (8) inspection of the application board during inspection of the application board, if a capacitor is connected to a pin with low impedance there is a possibility that it could cause stress to the ic, t herefore an electrical discharge should be performed after each process. also, as a measure again electrostatic discharge, it should be earthed during the assembly process and special care should be taken during transport or storage. furt hermore, when connecting to the jig dur ing the inspection process, the power supply should first be turned off and then removed before the inspection. (9) input terminal of ic between each element there is a p+ isolatio n for element partition and a p substrate. this p layer and each element?s n layer make up the p-n junction, and various parasitic elements are made up. for example, when the resistance and transistor are connected to the terminal as shown in figure 65, when gnd (terminal a) at the resistance and gnd (terminal b) at the transistor (npn), the p-n junction operates as a parasitic diode. also, when gnd (terminal b) at the transistor (npn), the parasitic npn transistor operates with the n layers of other elements close to the aforementioned parasitic diode. because of the ic?s structure, the creation of parasitic elements is inevitabl e from the electrical potential relationship. the operation of parasitic elements causes interferenc e in circuit operation, and can lead to malfunction and destruction. therefore, be careful not to use it in a way which causes the para sitic elements to operate, such as by applying voltage that is lower than the g nd (p substrate) to the input terminal. (10) ground wiring patterns when using both small signal and large current gnd patterns, it is recommended to isolate the two ground patterns, placing a single ground point at the application's refer ence point so that the pattern wiring resistance and voltage variations caused by large currents do not cause variations in the small signal ground voltage. be careful not to change the gnd wiring pattern potential of any external components, either. the japanese version of this document is formal specification. a customer may use this translation version only for a reference to help reading the formal version. if there are any differences in translation version of this document formal version takes priority resistor transistor (npn) n n n p + p + p p substrate gnd parasitic element terminal a n n p + p + p p substrate gnd parasitic element terminal b c b e n gnd terminal a terminal b other adjacent elements e b c gnd p aras iti c element p aras iti c e l emen t figure 30. pattern diagram of parasitic element
datasheet d a t a s h e e t 15/16 bd6563fv-lb tsz02201-0717abz00030-1-2 ? 2012 rohm co., ltd. all rights reserved. 13.jul.2012 rev.002 www.rohm.com tsz22111 ? 15 ? 001 ordering information b d 6 5 6 3 f v - lbe2 part number package fv : ssop-b16 packaging and forming specification e2: embossed tape and reel physical dimension tape and reel information marking diagram ssop-b16 (top view) 1pin mark product name. lot no. d6563 (unit : mm) ssop-b16 4.4 0.2 6.4 0.3 1.15 0.1 9 8 16 1 0.10 0.65 0.3min. 5.0 0.2 0.22 0.1 0.15 0.1 0.1 ? order quantity needs to be multiple of the minimum quantity. embossed carrier tape tape quantity direction of feed the direction is the 1pin of product is at the upper left when you hold reel on the left hand and you pull out the tape on the right hand 2500pcs e2 () direction of feed reel 1pin
datasheet d a t a s h e e t 16/16 bd6563fv-lb tsz02201-0717abz00030-1-2 ? 2012 rohm co., ltd. all rights reserved. 13.jul.2012 rev.002 www.rohm.com tsz22111 ? 15 ? 001 revision history date revision changes 05.jul.2012 001 new release 13.jul.2012 002 page 1 : change key specificat ions ?output peak current? page 4 : change absolute maximum ratings ?out_hx pin output current? page 4 : change absolute maximum ra tings ?out_lx pin output current?
datasheet d a t a s h e e t notice - rev.003 ? 2012 rohm co., ltd. all rights reserved. notice general precaution 1) before you use our products, you are requested to care fully read this document and fully understand its contents. rohm shall not be in any way responsible or liable for fa ilure, malfunction or accident arising from the use of any rohm?s products against warning, caution or note contained in this document. 2) all information contained in this document is current as of the issuing date and subjec t to change without any prior notice. before purchasing or using rohm?s products, please confirm the la test information with a rohm sales representative. precaution on using rohm products 1) our products are designed and manufactured for applicat ion in ordinary electronic equipments (such as av equipment, oa equipment, telecommunication equipment, home electroni c appliances, amusement equipment, etc.). if you intend to use our products in devices requiring extremel y high reliability (such as medical equipment, transport equipment, traffic equipment, aircraft/spacecra ft, nuclear power controllers, fuel c ontrollers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (?specific applications?), please consult with the rohm sale s representative in advance. unless otherwise agreed in writing by rohm in advance, ro hm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ro hm?s products for specific applications. 2) rohm designs and manufactures its products subject to strict quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe desi gn against the physical injury, damage to any property, which a failure or malfunction of our products may cause. the following are examples of safety measures: [a] installation of protection circuits or other protective devices to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3) our products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditio ns, as exemplified below. accordin gly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of an y rohm?s products under any special or extraordinary environments or conditions. if you intend to use our products under any special or extraordinary environments or conditions (as exemplified bel ow), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] use of our products in any types of liquid, incl uding water, oils, chemicals, and organic solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products ar e exposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed to static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing components, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (ev en if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4) the products are not subjec t to radiation-proof design. 5) please verify and confirm characteristics of the final or mounted products in using the products. 6) in particular, if a transient load (a large amount of load applied in a short per iod of time, such as pulse) is applied, confirmation of performance characteristics after on-boar d mounting is strongly recomm ended. avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading c ondition may negatively affect product performance and reliability. 7) de-rate power dissipation (pd) depending on ambient temper ature (ta). when used in seal ed area, confirm the actual ambient temperature. 8) confirm that operation temperature is within t he specified range described in the product specification. 9) rohm shall not be in any way responsible or liable for fa ilure induced under deviant condi tion from what is defined in this document.
datasheet d a t a s h e e t notice - rev.003 ? 2012 rohm co., ltd. all rights reserved. precaution for mounting / circuit board design 1) when a highly active halogenous (chlori ne, bromine, etc.) flux is used, the resi due of flux may negatively affect product performance and reliability. 2) in principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the rohm representative in advance. for details, please refer to rohm mounting specification precautions regarding application examples and external circuits 1) if change is made to the constant of an external circuit, pl ease allow a sufficient margin c onsidering variations of the characteristics of the products and external components, including transient characteri stics, as well as static characteristics. 2) you agree that application notes, re ference designs, and associated data and in formation contained in this document are presented only as guidance for products use. theref ore, in case you use such information, you are solely responsible for it and you must exercise your own indepen dent verification and judgment in the use of such information contained in this document. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take proper caution in your manufacturing process and storage so that voltage exceeding t he products maximum rating will not be applied to products. please take special care under dry condit ion (e.g. grounding of human body / equipment / solder iron, isolation from charged objects, se tting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1) product performance and soldered connections may deteriora te if the products are stor ed in the places where: [a] the products are exposed to sea winds or corros ive gases, including cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to di rect sunshine or condensation [d] the products are exposed to high electrostatic 2) even under rohm recommended storage c ondition, solderability of products out of recommended storage time period may be degraded. it is strongly recommended to confirm sol derability before using products of which storage time is exceeding the recommended storage time period. 3) store / transport cartons in the co rrect direction, which is indicated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4) use products within the specified time after opening a hum idity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage time period. precaution for product label qr code printed on rohm products label is for rohm?s internal use only. precaution for disposition when disposing products please dispose them proper ly using an authorized industry waste company. precaution for foreign exchange and foreign trade act since our products might fall under cont rolled goods prescribed by the applicable foreign exchange and foreign trade act, please consult with rohm representative in case of export. precaution regarding intellectual property rights 1) all information and data including but not limited to application example contain ed in this document is for reference only. rohm does not warrant that foregoi ng information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. rohm shall not be in any way responsible or liable for infringement of any intellectual property rights or ot her damages arising from use of such information or data.: 2) no license, expressly or implied, is granted hereby under any intellectual property rights or other rights of rohm or any third parties with respect to the information contained in this document.
datasheet d a t a s h e e t notice - rev.003 ? 2012 rohm co., ltd. all rights reserved. other precaution 1) the information contained in this document is provi ded on an ?as is? basis and rohm does not warrant that all information contained in this document is accurate and/or error-free. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or concerning such information. 2) this document may not be reprinted or reproduced, in whol e or in part, without prior written consent of rohm. 3) the products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 4) in no event shall you use in any way whatsoever the pr oducts and the related technical information contained in the products or this document for any military purposes, incl uding but not limited to, the development of mass-destruction weapons. 5) the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties.

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